This P-Channel MOSFET is produced using ON Semiconductor’s advanced PowerTrench® process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance.
Key Features
Max rDS(on) = 42mΩ at VGS =.
10V, ID =.
4.9A.
Max rDS(on) = 75mΩ at VGS =.
4.5V, ID =.
3.7A.
Low gate charge (17nC typical).
High performance trench technology for extremely low rDS(on).
SuperSOTTM.
6 package: small footprint (72% smaller than
standard SO.
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FDC610PZ P-Channel PowerTrench® MOSFET FDC610PZ P-Channel PowerTrench® MOSFET –30V, –4.9A, 42mΩ Features Max rDS(on) = 42mΩ at VGS = –10V, ID = –4.9A Max rDS(on) = 75...
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ures Max rDS(on) = 42mΩ at VGS = –10V, ID = –4.9A Max rDS(on) = 75mΩ at VGS = –4.5V, ID = –3.7A Low gate charge (17nC typical). High performance trench technology for extremely low rDS(on). SuperSOTTM –6 package: small footprint (72% smaller than standard SO–8) low profile (1mm thick). RoHS Compliant General Description This P-Channel MOSFET is produced using ON Semiconductor’s advanced PowerTrench® process that has been especially tailored to minimize the on-state resistance and yet maintain low gate charge for superior switching performance.